Cooler Master High Performance Thermal Paste 2.37g

Изображение может отличаться от реального товара, могут быть аксессуары и детали, не поставляемые с реальным товаром.
ID: 59594 Код товара: HTK-002-U1-GP
В наличии 30 шт.
Гарантия: 2 лет
11,73 €
Варианты доставки О доставке
  • Доставка на Smartpost бесплатно: в четверг, 28.11.2024
  • Доставка на пакомат Omniva бесплатно: в в четверг, 28.11.2024
  • Доставка в DPD Pickup Packet Locker бесплатно: в четверг, 28.11.2024
  • Доставка в почтовое отделение Латвии, камеру хранения посылок или Circle K бесплатно: в четверг, 28.11.2024.
  • Доставка по Риге 3,99 €: в в четверг, 28.11.2024
  • Доставка по Латвии 6,99 €: в в четверг, 28.11.2024
  • Доставка в пункт выдачи посылок Dateks.lv на улице Земитана, 9: во вторник, 26.11.2024 после 15:00
Основные параметры продукции Все параметры
  • Объем, г: 2.37
Все параметры
Объем, г : 2.37
Более подробная спецификация
Category - Root/Electronics/PC parts/Cooling/Thermal pastes
Category Code - COA
Category_1 - Computer Cases and Cooling
Category_2 - Thermal Materials
Colour - White
Description - Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.Features:Suitable for CPU, chipsets on Mainboard, VGA card, etc.Easy to useZif Socket Templates ensure correct applying area with various CPU socket typesProduces an even layer when using applicatorDielectricWide range of application temperature
Description - Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. Suitable for CPU, chipsets on Mainboard, VGA card, etc. Easy to use Zif Socket Templates ensure correct applying area with various CPU socket types. Produces an even layer when using applicator. Dielectric. Wide range of application temperature Thermal Conductivity 0.8 watts/meter-C Volume Resistivity 5.0 x 1015 Dielectric Constant 4.4 at 100k Hz Dissipation Factor 0.02 at 100k Hz Dielectric Strength 550 volts/mil; 21.7 kV/mm Shelf Life 24 months from DOM
Design features - Thermal Grease
dimensionalWeight - 71
dimension depth - 20 mm
dimension height - 180 mm
dimension weight - 36 g
dimension width - 10 mm
ean - 4719512002940
Eans - 4719512002940
EAN_code - 4719512002940
Features - Product colour - White
Features - Specific gravity - 2.37 g/cm³
Features - Thermal resistance - 0.8 °C/W
Features - Type - Thermal paste
Full Description Line - HTK-002|Thermal Grease|White
guarantee - 24
guarantee_type - normal
Manufacturer - Cooler Master
Manufacturer_code - HTK-002-U1-GP
Model - THERMAL PASTE COOLER MASTER Thermal Compound kit SC102 High Performance (HTK-002-U1-GP)
Model name - HTK-002
Name - Cooler Master HTK-002 High Performance
Name - Cooler Master HTK 002
name - Thermal Grease 2.0g
Packaging data - Package depth - 171 mm
Packaging data - Package height - 40 mm
Packaging data - Package width - 102 mm
Packaging data - Quantity per pack - 1 pc(s)
producer - Cooler Master
Producer - CoolerMaster
producerCode - HTK-002-U1-GP
ProducerCode - HTK-002-U1-GP
productName - Cooler Master HTK-002 heat sink compound Thermal paste
productSize - Normal
Shipping Box Depth Shipping/Package Box Dimensions - 17.5 cm
Shipping Box Height Shipping/Package Box Dimensions - 2 cm
Shipping box quantity - 1
Shipping Box Weight Shipping/Package Box Dimensions - 0.034 kg
Shipping Box Width Shipping/Package Box Dimensions - 10.5 cm
ShortDescription - pojemność: 2.0 g | kolor: biały
sizeX - 105
sizeY - 170
sizeZ - 20
Technical_details - Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. Content 2 gramme
Unit Box Height - 0.21
Unit Box Length - 0.253002
Unit Box Width - 0.009909
Unit Brutto Volume - 0.0003675 cubm
Unit Gross Weight - 0.034 kg
Unit Net Weight - 0.03 kg
Vendor Homepage - http://www.coolermaster.co.uk/product.php?product_id=6802
vendpn - HTK-002-U1-GP
Warranty - 24 months
warrantyLength - 24
warrantyType - G
Weight - 0,04
weight - 35
11,73 €
Cooler Master High Performance Thermal Paste 2.37g
Tālr. 67275758 gsm 26117175 (p.o.t.c.p. 9:00-18:00)
Intel technology provider Platinum 2020
Все категории